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Contact Us : pcb@welsa.com

Aluminum / Copper Based PCB

Due to recent developments in technology, a range of Hi-Power Surface mounted devices have been adopted by many industries, like automotive lighting and hi-power PCB producers. While the technology continues to expand its usage, a serious problem of heat dissipating was generated by low thermal conductivity performances of standard FR-4 PCB. The simplest solution is to apply Metal Based PCB. This technology is to replace a normal PCB with an metal substrate bonded on back of board for assuring that all the excess of heat produced is quickly dissipated. Even complicated multilayer PCBs can also be manufactured using this technique, with the aid of Thermal Vias.

Top Quality    Metal Based PCB

Aluminum Boards Product
Metal Based PCB Production Capability

Production Capability

*Types - Single side, 2 layer, (Metal Cored ) , 2 to 4 layer FR-4 + Metal Core based (Hybrid PCB )
*Material - Aluminum , Copper, Nickel Copper,Silver
*Thickness- 0.6mm to 5mm
*Working Panel - 6" x 20" (508mm x 610mm Aprox. ) (maximum size)
*Inner Layer-Trace width / Space = 4 / 4mil (minimum )
*Isolation Prepreg- Prepreg Thickness = 4mil (Minimum )
*Laminated Copper- 0.5 oz to 4 oz
*PTH- Ø 6mil (minimum ) / Registration+/-3mil / Tolerance +/-3mil
*Copper Plating- 500u"(Minimum )
*Solder Mask Printing Thickness- 0.4mil to 1.5mil / Mask Dam 6.5mil (Minimum ) / Exposure Registration +/-3mil
*Silkscreen/Legend- 5mil (Minimum )
*Surface Treatment- HASL, Immersion Tin ,Gold , Silver, Gold plating , Anodize Process on aluminum
*NPTH Ø-1 to 6.5mm (Minimum ) / Registration +/-3mi / Tolerance +/-3mil
*Special Mechanical Process Requirements- Counter Sunk , Controlled Depth Milling , Controlled Depth Drilling
*Others Mechanical Process- CNC Routing, Punching Tooling, V-Cut, Beveling
*Testing Methods- O/S Testing, Hi=Pot Testing
*Final Products Inspection -Visual Inspection 100%
*Certification- UL 94V-0 , RoHS, SGS Inspection
*Packing Method- Vacuumed Sealed Pack

Contact Us : pcb@welsa.com

Types of Metal Substrate Stackup
Types of Metal Substrate Lay-up

Due to recent developments in technology, a range of Hi-Power Surface mounted devices have been adopted by many industries, like automotive lighting and hi-power PCB producers. While the technology continues to expand its usage, a serious problem of heat dissipating was generated by low thermal conductivity performances of standard FR-4 PCB. The simplest solution is to apply Metal Based PCB. This technology is to replace a normal PCB with a metal substrate bonded on the back of board for assuring that all the excess of heat produced is quickly dissipated. Even complicated multilayer PCBs can also be manufactured using this technique, with the aid of Thermal Vias.

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