Air Gap

Air Gap - Through the process of selective bonding, increased flexibility is achieved by "unbonding" layers so they are allowed to flex freely. We are capable of designing and fabrication for this air gap technology allowing your designs more flexibility.

Shielding

Shielding is applied when an application requires limits in electromagnetic and/or electrostatic interference. Protective shielding can be patterned or solid. Either way, it reduces noise and controls the impedance of signal lines.

Panelisation / Stiffeners

During the panelisation process a stiffener is applied to the boundaries of multiple circuits on a panel so that they can be easily processed through the "pick & place" and wave soldering processes. Once the panel of circuit boards is done, simply clip them out and they are ready to go. Stiffeners are applied to flex circuits where additional support is needed such as areas of component assembly or underneath exposed traces that will be plugged in for connection. Common stiffeners are FR4 and polyimide.