Contact Us : pcb@welsa.com

AlumPCB-A3
Power Aluminum PCB
Copper Based Lighting Board
Copper based Material
AlumPCB-A13
LED Aluminum with balck solder mask
AlumPCB-A4
Panel by Routing
AlumPCB-A12
Depth control routing with finger
AlumPCB-A1
Immersion Gold aluminum board
AlumPCB-13-2Heatsink
Heatsink Based Aluminum Patterns on top
CopperPCB-C7-1
Copper Based PCB
AlumPCB-A19
Led Power PCB
2 Layer Aluminum PCB
CNC Routing for Outline, Vcut
Single Side Aluminum PCB
Lighting Boards
4 Layer FR-4 + Aluminum Based
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Aluminum / Copper Based PCB

Due to recent developments in technology, a range of Hi-Power Surface mounted devices have been adopted by many industries, like automotive lighting and hi-power PCB producers. While the technology continues to expand its usage, a serious problem of heat dissipating was generated by low thermal conductivity performances of standard FR-4 PCB. The simplest solution is to apply Metal Based PCB. This technology is to replace a normal PCB with an metal substrate bonded on back of board for assuring that all the excess of heat produced is quickly dissipated. Even complicated multilayer PCBs can also be manufactured using this technique, with the aid of Thermal Vias.

Top Quality    Metal Based PCB

 
 

Production Capability

*Types - Single side, 2 layer, (Metal Cored ) , 2 to 4 layer FR-4 + Metal Core based (Hybrid PCB )
*Material - Aluminum , Copper, Nickel Copper,Silver
*Thickness- 0.6mm to 5mm
*Working Panel - 6" x 20" (508mm x 610mm Aprox. ) (maximum size)
*Inner Layer-Trace width / Space = 4 / 4mil (minimum )
*Isolation Prepreg- Prepreg Thickness = 4mil (Minimum )
*Laminated Copper- 0.5 oz to 4 oz
*PTH- Ø 6mil (minimum ) / Registration+/-3mil / Tolerance +/-3mil
*Copper Plating- 500u"(Minimum )
*Solder Mask Printing Thickness- 0.4mil to 1.5mil / Mask Dam 6.5mil (Minimum ) / Exposure Registration +/-3mil
*Silkscreen/Legend- 5mil (Minimum )
*Surface Treatment- HASL, Immersion Tin ,Gold , Silver, Gold plating , Anodize Process on aluminum
*NPTH Ø-1 to 6.5mm (Minimum ) / Registration +/-3mi / Tolerance +/-3mil
*Special Mechanical Process Requirements- Counter Sunk , Controlled Depth Milling , Controlled Depth Drilling
*Others Mechanical Process- CNC Routing, Punching Tooling, V-Cut, Beveling
*Testing Methods- O/S Testing, Hi=Pot Testing
*Final Products Inspection -Visual Inspection 100%
*Certification- UL 94V-0 , RoHS, SGS Inspection
*Packing Method- Vacuumed Sealed Pack

Contact Us : pcb@welsa.com

 
Types of Metal Substrate Lay-up

Due to recent developments in technology, a range of Hi-Power Surface mounted devices have been adopted by many industries, like automotive lighting and hi-power PCB producers. While the technology continues to expand its usage, a serious problem of heat dissipating was generated by low thermal conductivity performances of standard FR-4 PCB. The simplest solution is to apply Metal Based PCB. This technology is to replace a normal PCB with a metal substrate bonded on the back of board for assuring that all the excess of heat produced is quickly dissipated. Even complicated multilayer PCBs can also be manufactured using this technique, with the aid of Thermal Vias.