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Printed Circuit Boards
  • Quick turn, Flexible Order Quantity, Reliable High Quality and Good Price.

We provide prototypes to volume production, giving customers the capability to order exactly what they needed. 

For more complex technical specifications of the board that you need, please contact us.

Or upload your Gerber and data to us and we will do the rest for you. We are also offering, kitting, component assembly. 

Printed Circuit Boards Gallery
PCB Manufacturing Capabilities
PCB Fabrication Specification

Files Types:

Gerber files ----- preferred format 274-X, 274-D, DPF, ODB++

Drill file-----X & Y coordinates, with tool sizes included

Maximum finished dimension 

23.62" x 15.74" – Single / Double Layer 

23.62" x 15.74" – 4 ~12 Layer

Minimum thickness

Single/Double 0.3mm +/-0.1mm (0.012" +/- 0.004" )
4 Layer 0.4mm +/-0.1mm (0.016" +/- 0.004")
6 Layer 0.6mm +/-0.1mm (0.024" +/- 0.004")
8 Layer 0.8mm +/-0.1mm (0.032" +/- 0.004")
10 Layer 1.0mm +/-0.12mm (0.04" +/-0.005")
12 Layer 1.2mm +/- 0.12mm (0.048" +/-0.005")

Maximum thickness

6.0mm +/- 10% (0.236" +/- 10% )

Bow and twist

< 7/1000

Laminate Material

FR-4 、High TG FR-4(170°C/180°C) 、Halogen free

FR-4 Laminate thickness (Standard) 1.6mm (0.062")
High TG FR-4 (170 degree C) 1.6mm (0.062")

Layer Construction

Maximum processed layer count 22 layer
Minimum core thickness 0.08mm (0.003") Standard / 0.05mm (0.002" ) Special


Minimum Size Mechanical Drill -0.2mm (0.008") / Laser Drill-0.1mm (0.004")
Maximum Size 6.0mm
True Position Tolerance +/- 0.002" (0.050mm)
Tolerance of PTH +/- 0.003" (0.075mm)
Tolerance of NPTH +/- 0.002" (0.050mm)
Annular Ring +/- 0.005" (0.127mm)

Blind & Buried via

Plug vias by conductive epoxy
Plug vias by solder mask ink

Copper Plating

Minimum in Holes 0.008"
Aspect Ratio (Drilling Hole Size /PCB Thickness 15 )

Conductors (Traces)

Finished trace size +/-20%
Min. Trace Width / Space (1 oz finished Cu) Starting from 1/3oz 0.003"/0.003" (0.08mm)
Min. Trace Width / Space (1 oz finished Cu) Starting from 1/2oz 0.004"/0.004" (0.1mm)
Min. Trace Width / Space (2 oz finished Cu) 0.008"/0.008" (0.2mm)
Min. Trace Width / Space (3 oz finished Cu) 0.010"/0.011" (0.26mm )
Min. Trace Width / Space (4 oz finished Cu) 0.012"/0.014" (0.3mm)

Inner Layers

Minimum space drill to conductor 0.006" (0.15mm)
Minimum annular ring 0.006" (0.15mm)
Layer to layer registration +/-0.005"(0.127mm)

Solder Mask

Colors Green, White, Black, Yellow, Red, Blue, Matte Green & Black
Nominal Thickness Thickness: 0.4mil to 0.6mil
Min. Solder Mask Clearance Mask Dam 3mil (Minimum )
Exposure Registration +/-3mil


Colors White, Black, Yellow
Minimum Silkscreen Clearance 0.005"
Minimum Heigh /Width 0.028" / 0.028"

Board Routing & Profile

Tolerance Board Edge & Cutouts +/-0.15mm (0.006")
Score Line to Edge of Board +/-0.15mm (0.006")
Depth of V-Scoring (Board Thickness>=0.04") +/-0.1mm (0.004")
Deviation of V-scoring +/-0.1mm (0.004")
Half-Moon Shape Yes

Special Mechanical Requirements

Counter Sunk , Controlled Depth Milling, Controlled Depth Drilling

Surface Finished

HASL / Lead Free HAL Vertical 50u" to 300u"
Immersion Gold Thickness 2u" to 3u" suggested but max. 8u"
Hard Gold Thickness up to 50u" (Need copper connection)
Immersion Tin Thickness 40u" to 50u"
Immersion Silver Thickness 8u" to 12u"
OSP (Entek ) Yes
Gold plated edge connectors, Max. 50u" Au, over 120u" Ni

Quality Standard & Packing

IPC-600 Pictorial Guide Apply Class II to Determine Defects Visual Inspection 100%,
UL Certification UL 94V-0 , RoHS, SGS Inspection

Packing Method Vacuumed Sealed Pack

Welsa HDI Capabilities
HDI PCB Structure Layup
Anylayer stackup.jpg
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